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2024 IEEE Symposium on Reliability for Electronics and Photonics Packaging (REPP)
West Lafayette, Indiana USA
Nov 7, 2024 - Nov 8, 2024
Abstract Submission Date: Aug 15, 2024
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2024 21st China International Forum on Solid State Lighting & 2024 10th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS)
Suzhou, China
Nov 18, 2024 - Nov 21, 2024
Abstract Submission Date: Aug 15, 2024
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2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
Dallas, Texas USA
May 26, 2025 - May 31, 2025
Abstract Submission Date: Oct 8, 2024
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2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Dallas, Texas USA
May 27, 2025 - May 30, 2025
Abstract Submission Date: Sep 2, 2024
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IEEE Electronics Packaging Award
Recipient of the 2024
IEEE Rao R. Tummala Electronics Packaging Award
Madhavan Swaminathan
“For contributions to semiconductor packaging and system integration technologies that improve the performance, efficiency, and capabilities of electronic systems.”
Tel Aviv, Israel
Jul 9, 2024 - Jul 11, 2024
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