NextFlex

NextFlex hosted its annual member meeting, Innovation Days, March 26 & 27, with two full days of technical talks, networking, technology demonstrations, and tours of the NextFlex Technology Hub. Attended by 180 industry, academia, and government partners, the event began with a keynote address from Ian Steff, President and CEO of MySilicon Compass, who delighted the audience with stories of his deep connection to NextFlex’s beginnings as an Executive Advisor to the FlexTech Alliance’s proposal that ultimately won to competition to start NextFlex. Several important announcements were made during Innovation Days including recognition for Lorain County Community College as NextFlex’s first EWD Innovation Center, highlighting their leadership in education and partnership with NextFlex’s EWD strategy. Rebecca Lewis, Director of Education and Workforce Development, presented the award to LCCC’s Terri Burgess Sandu and Deanna Strauss Hersko. NextFlex also announced its first ambitious fundraising campaign to support Women in STEM with a goal of raising $5M. 🔗 to press release: https://lnkd.in/eid4ynh5 Nick Morris, Deputy Director of Technology, announced the release of newly updated manufacturing roadmaps, with plans to connect with members for topics that will lead to Project Call 9.0 tentatively slated for June. Finally, five new NextFlex Fellows were announced: Kenneth Church, Ph.D., nScrypt; Andrew Kwas, Northrop Grumman; Erick King, Capital Youth Empowerment Program; David Sabanosh, US Army DEVCOM Armament Center, and Madhu Stemmermann, SunRay Scientific. #AdvancedManufacturing #HybridElectronics #WorkforceDevelopment #CHIPSAct #Electronics #Packaging #PrintedElectronics #STEM #WomenInStem #Networking

Engage with NextFlex at SEMICON WEST! 📌 CHIPS Proposal Overview – NextFlex will present an overview of its proposal to the CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Materials and Substrates funding opportunity, the first major R&D program competed through the CHIPS Program. This presentation will be given by Dr. Scott Miller, Director of Technology at NextFlex, on Wednesday, July 10, from 9:00 to 9:30 am at the Moscone Center South, Level 3, Room 304. Manufacturing Roadmap Overview – NextFlex will present an overview of its latest Hybrid Electronics Manufacturing Roadmaps to include a forward-looking view into these six markets: Automotive; Asset Monitoring Systems; Flexible Power; Human Monitoring Systems; Integrated Antenna Arrays, and Soft and Wearable Robotics, plus these five manufacturing thrust areas: Device Integration and Packaging; Materials; Modeling and Design; Printed Components and Microfluidics, and Standards, Test and Reliability. This presentation will be given by Dr. Scott Miller, Director of Technology at NextFlex, on Wednesday, July 10 from 9:30 to 10:00 am at the Moscone Center South, Level 3, Room 304. NextFlex Technology Hub Capabilities Overview – NextFlex will present an overview of the design, prototype, manufacturing and test capabilities at the Technology Hub in San Jose, California. This presentation will be given by Dr. Art Wall, Director of Engineering and Fab Operations at NextFlex, on Wednesday, July 10 from 10:00 am to 10:30 am at the Moscone Center South, Level 3, Room 304. NextFlex Project Call 9.0 Coaching Sessions – As you may know, NextFlex launched its 9th Project Call in June, with cover sheets due July 17. Don’t miss this opportunity to meet with Dr. Scott Miller, Director of Technology at NextFlex, to learn more about the Project Call program at NextFlex, the topics included in PC 9.0, and to gain insight into potential collaboration teams. Use this online form to request a meeting time onsite at SEMICON West/FLEX conference to secure a time to meet with Dr. Miller in Room 304 at the Moscone Center South, Level 3. All participants are required to be registered for SEMICON West to access Room 304 in the Moscone South Hall, Level 3 #CHIPS #NAPMP #Packaging #nmanufacturing #technology #electronics #semiconwest Click below to to Sign p for a PC.9.0 Coaching Session ! https://lnkd.in/gDNHB2Td

NextFlex Presents at Sensors Converge Conference 🎉 NextFlex was invited to speak at this week's Sensors Converge preconference session. NextFlex's Alexander Cook gave a presentation outlining work on integrating FHE into textiles, work completed under the MDO phase I and phase II projects. Other speakers at the preconference included Massood Atashbar, IEEE Fellow, NextFlex Fellow from Western Michigan University, Mark Waugh of Murata, Robert Irwin of Molex, @Joseph Wong of UC San Diego, and Radislav A. Potyrailo of GE Vernova. Topics focused on challenges and opportunities for printed, flexible, stretchable, and functional e-fabric sensors and sensors-based systems which enable IoT and wearable applications. The presentations and conference were well attended and productive. One NextFlex member remarked on receiving tens of commercial leads per day of attendance. #electronics #technology #hybridelectronics #sensors #printedelectronics

🔆Join us in the comments by wishing our members a happy membership-aversary! This week we would like to recognize the following members and their membership anniversaries: EWI – 7 Years of Membership ChemCubed – 3 Years of Membership Lithoz – 2 Years of Membership 🔆Thank you for all that you do! We value you as a member and are happy to collaborate with you to advance the hybrid electronics community. Jeff Ellis - EWI James Cruz - EWI Daniel Slep PhD - ChemCubed Beth Bornick - Lithoz America Shawn Allan - Lithoz America

AN INTERVIEW WITH CARL KALIN OF BIOSENSOR SOLUTIONS Check out our latest blog post where we had the opportunity to interview Carl Kalin about his organization as it is a relatively new member in the NextFlex community. Click below to learn about what key innovations BioSensor Solutions is working on. #microbiology #printedelectronics #electronics #technology https://lnkd.in/gvcJVFuS

Alexander Cook, Engineering Manager at NextFlex during #SensorsCoverge 2024 Pre-Con Workshop Today! Alex will be speaking on Scalable Architecture for Integration of Flexible Hybrid Electronics into Smart Textiles to Support Human Monitoring, Communications and Performance. To view full agenda, please visit: https://lnkd.in/gEdifMni #hyrbidelectronics #electronics #flexibleelectronics #technology

Check out the pre-conference workshop at #SensorsConverge: Challenges and Opportunities for Printed, Flexible, Stretchable, and Functional/E-Fabric Sensors and Sensor-Based Systems: New Platforms Enabling Novel Solutions for IoT and Wearable Applications Featuring an incredible lineup of speakers: Roger Grace of Roger Grace Associates Massood Atashbar, IEEE Fellow, NextFlex Fellow, Dinesh Maddipatla, Western Michigan University Alexander Cook, NextFlex Robert Irwin, Molex Mark Waugh, Murata Electronics North America, Inc Joseph Wong, UC San Diego Check out the workshop's full agenda: https://sched.co/1bpQl Secure your pass here: https://lnkd.in/ea_UcGyY #efabric #sensors #sensorsbasedsysems #iot #wearable #medtech

💡Join us in the comments by wishing our members a happy membership-aversary! This week we would like to recognize the following members and their membership anniversaries: Oregon State University – 2 Years of Membership Nano OPS, INC.– 3 Years of Membership Ames Goldsmith Corporation — 2 Years of Membership 💡Thank you for all that you do! We value you as a member and are happy to collaborate with you to advance the hybrid electronics community. Tom Weller - Oregon State University Harish Subbaraman (he/him) - Oregon State University Sudhir Jain - Nano Ops Ahmed Busnaina - Nano Ops Ionel Halaciuga - Ames Goldsmith Frank Barber - Ames Goldsmith James W. - Ames Goldsmith

Last week, we launched PC 9.0! PC 9.0 is our ninth project call designed to foster technology innovation and commercialization. If you missed our virtual Proposer’s Day and Teaming Event on June 10, click the link below to view a recording of that session. If you’re interested in submitting a proposal or would like to talk with us about your ideas, please reach out to us. https://lnkd.in/gGptmNNB #manufacturing #electronics #technology #engineering #commercialization

We are excited to announce our new member, Boston University! Join us in welcoming them to the community 👋