Guillermo Echeverria

The Continuous Improvement (CI) department was created in 2009 and its main goal is to lead development of continuous improvement expertise in district staff and support implementation of district-wide projects. Currently we support 12 academic and operations departments with 100 active employees in training and implementing projects.

Business process improvement practices to boost productivity, improve customer service,
enhance accountability, and correlate metrics in the central… Show more

The Continuous Improvement (CI) department was created in 2009 and its main goal is to lead development of continuous improvement expertise in district staff and support implementation of district-wide projects. Currently we support 12 academic and operations departments with 100 active employees in training and implementing projects.

Business process improvement practices to boost productivity, improve customer service,
enhance accountability, and correlate metrics in the central office to overall
student performance. The Denver Public Schools transformation started with a strategic plan focused on three key areas:
1. ?People: Denver needed to attract, retain, develop, incent and, if necessary, remove people
based on performance. They needed the data to show how performance is occurring in
the classroom and use those experiences to help their educators build a performance
management culture.
2. Performance and Accountability: Denver is measuring outcomes, measuring against
goals, and keeping track of whether people are doing what they say they are going to do.
3. ?Building a Service?culture: Denver looked at who their customers were for each
department or person in their organization and focused on how to meet their needs
and wants Show less

Effect of Lead-free Assembly Processing on Solder Joint Voiding
Government regulations and environmental initiatives are forcing the electronics assembly industry to migrate away from the use of lead in solder joints, bringing new challenges to the electronics industry. One of the many issues associated with Pb- free implementation that concerns electronic assemblers is the possibility of increased voiding in the solder joint. Voiding may indicate that the assembly process is not fully… Show more

Effect of Lead-free Assembly Processing on Solder Joint Voiding
Government regulations and environmental initiatives are forcing the electronics assembly industry to migrate away from the use of lead in solder joints, bringing new challenges to the electronics industry. One of the many issues associated with Pb- free implementation that concerns electronic assemblers is the possibility of increased voiding in the solder joint. Voiding may indicate that the assembly process is not fully optimized for the metallurgical and chemical soldering system being employed. Excessive voiding may affect solder joint mechanical properties, decreasing the strength, ductility and fatigue life of essential interconnections. Therefore, it is important to understand the factors and the interactions between surface finishes and solder-alloy systems that affect voiding in order to make the necessary process recommendations to reduce or eliminate the occurrence and size of the voids. A study was conducted to identify the most significant parameters related to voiding for Pb-free and tin-lead Ball Grid Array (BGA) packages assembled with Pb-free solder paste. Several factors were compared, namely: surface finish, reflow profile, reflow atmosphere and solder ball alloy (Pb-free or Sn-Pb). The results of this study will help to better understand the variables that affect voiding so that it can be predicted and minimized. Voiding data was measured using an X-ray system and micro-sections were performed to corroborate the X-ray findings. Show less

Echeverria, Santos, Shea, and Chouta. “Effect of Lead-Free Assembly Processing on Solder Joint Voiding”. IPC/JEDEC International Conference on Lead Free Electronic Components and Assemblies. March 2004, San Jose. (Presenter)

Government regulations and environmental initiatives are forcing the electronics assembly industry to migrate away from the use of lead in solder joints, bringing new challenges to the electronics industry. One of the many issues associated with Pb- free implementation that concerns electronic assemblers is the possibility of increased voiding in the solder joint. Voiding may indicate that the assembly process is not fully optimized for the metallurgical and chemical soldering system being… Show more

Government regulations and environmental initiatives are forcing the electronics assembly industry to migrate away from the use of lead in solder joints, bringing new challenges to the electronics industry. One of the many issues associated with Pb- free implementation that concerns electronic assemblers is the possibility of increased voiding in the solder joint. Voiding may indicate that the assembly process is not fully optimized for the metallurgical and chemical soldering system being employed. Excessive voiding may affect solder joint mechanical properties, decreasing the strength, ductility and fatigue life of essential interconnections. Therefore, it is important to understand the factors and the interactions between surface finishes and solder-alloy systems that affect voiding in order to make the necessary process recommendations to reduce or eliminate the occurrence and size of the voids. A study was conducted to identify the most significant parameters related to voiding for Pb-free and tin-lead Ball Grid Array (BGA) packages assembled with Pb-free solder paste. Several factors were compared, namely: surface finish, reflow profile, reflow atmosphere and solder ball alloy (Pb-free or Sn-Pb). The results of this study will help to better understand the variables that affect voiding so that it can be predicted and minimized. Voiding data was measured using an X-ray system and micro-sections were performed to corroborate the X-ray findings.
Show less

A Research Report by the Lead Free Technical Subcommittee
Government regulations and environmental initiatives are forcing the electronics assembly industry to migrate away from the use of lead in solder joints, bringing new challenges to the electronics industry. One of the many issues associated with Pb- free implementation that concerns electronic assemblers is the possibility of increased voiding in the solder joint. Voiding may indicate that the assembly process is not fully optimized… Show more

A Research Report by the Lead Free Technical Subcommittee
Government regulations and environmental initiatives are forcing the electronics assembly industry to migrate away from the use of lead in solder joints, bringing new challenges to the electronics industry. One of the many issues associated with Pb- free implementation that concerns electronic assemblers is the possibility of increased voiding in the solder joint. Voiding may indicate that the assembly process is not fully optimized for the metallurgical and chemical soldering system being employed. Excessive voiding may affect solder joint mechanical properties, decreasing the strength, ductility and fatigue life of essential interconnections. Therefore, it is important to understand the factors and the interactions between surface finishes and solder-alloy systems that affect voiding in order to make the necessary process recommendations to reduce or eliminate the occurrence and size of the voids. A study was conducted to identify the most significant parameters related to voiding for Pb-free and tin-lead Ball Grid Array (BGA) packages assembled with Pb-free solder paste. Several factors were compared, namely: surface finish, reflow profile, reflow atmosphere and solder ball alloy (Pb-free or Sn-Pb). The results of this study will help to better understand the variables that affect voiding so that it can be predicted and minimized. Voiding data was measured using an X-ray system and micro-sections were performed to corroborate the X-ray findings. Show less