Tracker Mechanical/Process Engineer

6 Month Contract Position

Job Summary:

The Engineer, Manufacturing Process is responsible for designing, developing, deploying and optimizing processes for manufacturing to achieve quality cost and delivery goals for Celestica and its customer’s products.

Detailed Description:

Performs tasks such as, but not limited to, the following:

• Design, develop, and implement new manufacturing processes to support customer products.
• Develop application software and tooling for a series of complex machines and mechanical process steps within a manufacturing sector.
• Execute with support, capability of machines and process steps using Design of Experiments and statistical methods to ensure maximum utilization of critical resources, maximum throughput, minimum cost and capacity growth; involves integrating equipment, people, material flow, and information systems.
• Solve technical product, process, component, and related problems that affect the efficient operation and/or manufacture of products.
• Provide feedback to product designers on suitability of designs for manufacturability with supervision.

Enabling Competencies:

• Project Management - Ability to manage a single line engineering project with a limited number of participants. Create a project/change management plan, establish and distribute project roles, and communicate what is needed from the project participants in order to make the project successful.
• Leadership - Demonstrate "Individual Leadership Behaviors" as per Celestica Leadership Imperatives.
• Financial Acumen / Business Planning -Solid understanding of Celestica’s budgeting and accounting system and the cost accounting practices relevant to engineering work. Always act with the awareness of your work's impact on financial results. Communicate clearly and timely all aspects of your work that may have an influence on the profitability of the project and/or what is necessary for proper accounting and controlling.
• The following competencies may also be required and performed with help or under supervision: Coaching/Mentoring; Communication/Negotiation/Presentation; Creative Problem Solving; Customer Interaction/Stakeholder Management; Quality & Lean; Working Effectively with Others; D/PFMEA; 8D/Corrective Action; Equipment Safety; Design of Experiments (DOE).

Technical Competencies:

The following are the associated Technical Competencies that are required for the various Standard Jobs within the Process Engineering Manufacturing career stream. This list is for illustrative purposes and may not be inclusive of all skills.

STANDARD JOB : Technical Skills

• NPI-PCBA: ESD, Component Prep, Laser marking, Solder Paste Deposition (screening / jetting) / Stencil Design, SMT component placement, Reflow, Tooling design, PTH soldering, PTH manual assembly, Press Fit assembly, Depanelization, Board level mechanical assembly, wire harness assembly, wire prep, SMT data analytics, SMT / PTH manual / automated rework, cleaning processes, coating / potting underfill / ruggedization processes, pack & ship, optical component assembly, fiber / tray handling processes, fiber splicing, IPC-610, quality data (KPI), Engineering Control & System Tools (ODC/SCE), Manufacturing Operational management, DFM - Mfg, DFA, DFR, Customer specific processes, structural test and inspection processes, machining, welding, CNC programming, secondary processes, sheet metal, DFAA.
• DFX: ESD Controls, Component Prep, Component Module Programming, Laser Marking, Screening, Stencil Design, Solder Paste Dispense / Jetting, SMT Programming, SMT Placement, SMT Reflow, Sweat Soldering, Flex Board Assembly / Handling, Pallet Design, PTH Soldering, Robot Soldering, PTH manual Assembly, PTH Auto Assembly, Pressfit, Depanelization, Mechanical Assemb;y (TIMs, Heatsinks, PCBA, Hotbar, Ultrasonic Welding), Wire Harness Assembly, Wire Prep, System Assembly, SMT and PTH Rework, Cleaning Processes, Conformal Coating, Underfills / Edgebonding / Potting, Pack and Ship, Chassis Assembly (fluidics, electrical enclosure, cable routing), Sheet Metal , Machining, Welding, Structural Test (API, AOI, AXI, ICT, Flying Probe)
• FA LAB : ESD Controls, Solder Metallurgy, Strain Gauge Analysis, SIR Testing, Solder Joint Reliability Modeling, Sample Prep (Grind and Polish), Dye & Pry, CMM/VMM, Lab Xray, Pull/Bend Testing, Vibration Testing, Drop Testing, TDR, XRF, SEM, FTIR, IC, Solderability Testing, Thermal Analysis, HALT/HASS, TH&B, Thermal Shock, ATC
• OPTICAL & XRAY INSPECTION : ESD Controls, Auto Wire Prep, SMT Data Analytics, API, AOI (PCBA), AXI (PCBA), AOI (System), Test Strategy Creation, IPC-610, Quality Dat (KPI), DFM - Manufacturing, DFA - Assembly, DFT / Physical Test, DFT - Electrical Test
• MACHINING & OTHER : ESD Controls, Pack & Ship, CNC programming, Secondary Processing, Sheet Metal, Machining, Welding, DFM - Manufacturing
• MECHANICAL & SYSTEMS ASSEMBLY : ESD Controls, Wire Harness Assembly, Auto Wire Prep, Mechanical Assembly - System Build, OEE / Industrial Engineering, Pack & Ship, Vacuum System, Fluidics, Electrical Enclosure, Cable Routing, Electrical - Automation, Mechanical - Automation, Machine Vision, IPC-610, Engineering Controls, Quality Data (KPI), Manufacturing Operational Management, DFM - Manufacturing, DFA - Assembly, DFAA - Automated Assembly, DFT - Physical Test
• PCBA ASSEMBLY : ESD, Component Prep, Laser marking, Solder Paste Deposition (screening / jetting) / Stencil Design, SMT component placement, Reflow, Tooling design, PTH soldering, PTH manual assembly, Press Fit assembly, Depanelization, Board level mechanical assembly, wire harness assembly, wire prep, SMT data analytics, SMT / PTH manual / automated rework, cleaning processes, coating / potting underfill / ruggedization processes, pack & ship, optical component assembly, fiber / tray handling processes, fiber splicing, IPC-610, quality data (KPI), Manufacturing Operational management, DFM - Mfg, DFA, DFR, Customer specific processes.
• MICROELECTRONICS : ESD Controls, Wafer Thinning, Wafer Singulation, Edge Polishing, Optical Coatings, Die Bonding, Vacuum Reflow, Flip Chip Bonding, Underfill, Active Alignment, Plasma Cleaning, Wire Bonding, Encapsulation, Sealing, Leak Testing, Interconnect Formation

Physical Demands:

• Duties of this position are performed in a normal office environment.
• Duties may require extended periods of sitting and sustained visual concentration on a computer monitor or on numbers and other detailed data.
• Repetitive manual movements (e.g., data entry, using a computer mouse, using a calculator, etc.) are frequently required.
• Occasional travel may be required.

Typical Experience:

1 to 3 years of relevant experience.

Typical Education:

Bachelor degree or consideration of an equivalent combination of education and experience.

Educational Requirements may vary by Geography

Notes: This job description is not intended to be an exhaustive list of all duties and responsibilities of the position. Employees are held accountable for all duties of the job. Job duties and the % of time identified for any function are subject to change at any time.