Very exciting Micron news: We just started sampling High Bandwidth Memory (HBM3), a type of advanced packaging that stacks chiplets on top of each other--like floors in a skyscraper--to produce a lot of memory while only sipping power. Why is this important? In order for AI to advance, it needs more powerful memory, which Micron is delivering with this second generation of HBM. Our HBM3 integrates higher-density chiplets, so it can be 50 percent higher capacity, with 2.5x better performance/power ratings and 50 percent faster speed (1.2Tbytes/second). This is the industry’s equivalent of a triple threat!
With leading-edge design and innovations, our HBM3 Gen2 unleashes the performance of #AI with industry's first 1.2TB/sec HBM.
Get a 50% increase in capacity in the same footprint of 11mm x 11mm and greater than 2.5x performance/watt made possible with the industry's most advanced 1-Beta process node. Includes advanced packaging technologies with up to 2x TSVs and 25% shrink in-package interconnects.
Learn more about the future of AI with HBM3 Gen2: https://bit.ly/3qeoawN
Woodworke at OCE WOODSHOP
2wLove this very much, I'm looking forward to work for a semiconductor company.