Monolithic Power Systems, Inc.’s Post

🌏 ECOSYSTEM ACCELERATION OF WBG POWER SEMICONDUCTORS AND THE IMPACT TO SOCIETY will be the Theme of the highly anticipated Senior Executive Gathering Exclusively for the Power Semiconductor Manufacturing Community covering major topics in SiC & GaN Technologies will be hosted on September 14-15 in Italy, Lake Maggiore. 🗣️We welcome Speaker Jeroen van Borkulo - Head of Business & Marketing at ASMPT Ltd will present on How Laser is Enabling The Power Semiconductor Roadmap. To keep up with the drive for improved electrical performance of Power Semiconductor devices, chip designers are looking at thinner wafers and moving from Si to SiC and GaN wafer substrates. Due to the increased electrification in our daily life we see a strong increase in power semiconductor applications for mobile, automotive, industrial, renewable energies, etc. As a result of this increase in volume, the market is looking at new wafer singulation technologies to keep up with the technology requirements as well as the cost. ASMPT developed a patented Ultra-Violet (UV) nano second laser dicing technology for thin SiC wafers (100 – 150 μm), which allows customers to continue their technology roadmap and which is competitive from a Cost of Ownership (CoO) to the conventional saw blade dicing technology. Blade dicing is encountering yield issues and due to the hardness of SiC, high consumable cost and low throughput. During our presentation at ISES EU Power 2023 we will share the laser technology concept used and the results achieved for dicing of thin SiC power semiconductor devices including reliability data and CoO. Key words: SiC, Dicing, Power Semiconductors, Thin Wafer, Multiple Beam ⭐️ Registration is now open: https://lnkd.in/dhjcrD7a 💥 Key companies in attendance include: Volkswagen Group, Škoda Group, Renault Group, Volvo Group, onsemi, ZF Group, Vitesco Technologies, Ferrari, Wolfspeed, STMicroelectronics, Bosch, BelGaN, Innoscience, Efficient Power Conversion, Hitachi Energy and many more... #ISESEUPOWER2023 #SemiconductorEvent #WBGPowerSemiconductors #AutomotiveApplications #SemiconductorIndustry #Innovation #SiC #GaN

We are glad to be one of the speakers in ISES EU Power 2023. Jeroen van Borkulo, Head of Business & Marketing of ASMPT ALSI, is going to share "How Laser is Enabling The Power Semiconductor Roadmap" with us. In order to keep up with the demand for improved electrical performance of Power Semiconductor devices, chip designers are exploring new avenues such as thinner wafers and utilizing SiC and GaN wafer substrates instead of Si. ASMPT Ltd has developed a patented Ultra-Violet (UV) nanosecond laser dicing technology that enables the dicing of thin SiC wafers (100-150 μm), allowing customers to continue their technology roadmap in a cost-effective manner compared to conventional saw blade dicing technology. Blade dicing has encountered yield issues due to the hardness of SiC, high consumable cost, and low throughput. At our presentation at ISES EU Power 2023, we will share the laser technology concept used, the achieved results for dicing of thin SiC power semiconductor devices (including reliability data and CoO), and how it can help customers overcome the challenges faced by blade dicing. #technology #laser #lasertechnology #laserdicing #SiC #GaN #Dicing #powerelectronics #powersemiconductor #Semiconductors #semiconductor #innovation #ThinWafer #MultipleBeam

Exciting News in the Semiconductor Industry! 🚀 Despite market weaknesses, the semiconductor world is gearing up for significant growth in 2023! 📈 According to the reputable market research firm, Knometa Research Corp, a staggering 13 additional 300mm wafer fabs are set to commence production this year! 🏭💥 These fabs have a vital purpose - to produce discrete power semiconductors, responding to the ever-increasing demand fueled by the electrification of automobiles 🚗🔌. As the world shifts towards sustainable transportation solutions, these semiconductors will play a crucial role in powering the vehicles of the future! ⚡ As of the end of 2022, Knometa reported 167 semiconductor fabs processing 300mm-diameter wafers, utilized for fabricating ICs and even non-IC products such as power discretes. And guess what? By the end of this year, that number is projected to rise even further to 180! 📈 This industry growth is a testament to the unwavering commitment of our brilliant engineers, innovators, and technology enthusiasts who are constantly pushing the boundaries of what's possible! 🌟 Join the wave of transformation as we witness groundbreaking developments in the semiconductor realm. If you're passionate about technology, automotive electrification, or the future of sustainable energy, this is a journey you wouldn't want to miss! 🌐🔋 #SemiconductorIndustry #AutomotiveElectrification #TechnologyInnovation #SustainableFuture #SemiconductorFabs #KnometaResearchCorp #TechEnthusiasts #jointhewave #semiconductor https://lnkd.in/dmUsWARN

A dynamic ecosystem which brings lot of opportunities and different business models .. partnerships and M&A are key moves within our industry #semiconductors #SeamlessWaves

Power #SiC: What has motivated the flood of partnerships across the supply chain? (by Yole Group) 💡 There has been a flurry of impactful collaborations announced in the last year within the power SiC market, and interestingly, not just at the wafer and material level as previously seen, but across the entire power SiC ecosystem. Partnerships established across entire supply chain - driven by #automotive The #automotive market, mainly driven by #inverters, along with onboard #chargers and DC-DC converters in #electricvehicles, represents 70% of the power SiC market share in 2022, which is set to grow to 74% by 2028, according to Yole Intelligence’s analyses. Major SiC device manufacturers, STMicroelectronics, Infineon Technologies, onsemi, Wolfspeed and ROHM Co., Ltd., have been busy forming design-win partnerships with major OEMs, signifying the significant future revenue major OEMs and suppliers envision in the market. As of 2023, the majority of power #electronics players have SiC activities, including all of the top 10 companies. A big thank you again to Yole Intelligence and especially to Poshun CHIU , Ezgi Dogmus, PhD , Taha Ayari, PhD for the full article with more background, insights, charts and the opportunity to get a preview of the annual Yole "Power SiC 2023 market report" via the link below 💡🙏👇 https://lnkd.in/eFQS2RFR #semiconductorindustry #semiconductors #semiconductor #chip #chips #technology #automotiveindustry #automotivetechnology #electronics #it #automotiveelectronics #tesla #evehicles #hyundai #stellantis #vw #bmw #volkswagen #mercedesbenz #volvo #generalmotors #nio #xpeng #lucid #germany #japan #italy #france #usa #foundry #foundries #ic #ics #ev

Session 3.1 is almost coming to an end. Focusing on the Future of MEMS Technology, we saw the many exciting new MEMS applications and device concepts that are emerging. 👀 This session, chaired by Bernd Dielacher, Business Development Manager, MEMS at EV Group addressed MEMS technology's latest developments and trends, including roadmaps and market forecasts. A particular focus was also given to audio technologies, novel biosensing concepts, and manufacturing challenges. Speakers featured during this session include: - Pierre-Marie Visse, Senior Analyst for MEMS & Sensors, Yole Group - Christophe Zinck, Director, Technical Program Management, ASE Global. - Julia Brückner, Global Applications & Product Engineering Manager for the Packaging & Wafer Business Unit, Corning Incorporated - Marc Sansa, R&D Project Manager, CEA-Leti - Moti Margalit, CEO, SonicEdge Ltd. - Heinrich Heiss, Distinguished Engineer 3D Sensing, Infineon Technologies Don't miss out on any of today's speakers, check out the agenda online https://bit.ly/3PDmneA #MEMSSummit #MEMS #Imaging #Sensors #Europe

Radar systems are essential for #autonomousdriving, but to achieve full autonomy, the number of radar sensors in each car needs to rise from one to around ten. This requires affordable yet high-performance solutions that are easy to integrate and replace on the car's exterior. The #MID4automotive #Xecs project will employ 3D-MID technology, which enables the three-dimensional placement of components and offers flexibility in designing the final module, to meet these needs. Xecs is an Eureka Network Cluster operated by AENEAS #ECS #innovation #automotive

🚀 The 1st year review of the #MID4automotive #Xecs Project took place today in Germany 👇 🎯 The combination of electronics and MID technology opens up new potential: the project goal is to develop low-cost, high-performance and highly integrated radar systems that can be directly integrated into plastic surfaces. This will be based on 3D-MID (Molded Interconnect Device) technology. Radar transceivers integrated in this way will be connected directly to the antennas to minimise losses due to reflection, attenuation and phase shift. Keep an eye out to learn about the progress and developments within this project. ➡ https://lnkd.in/eGSmMMN7 🤝 Congratulations to all project partners on a successful first year, and best wishes for continued productive collaboration: ASTRON Eindhoven University of Technology Fraunhofer IEM Fujikura Europe GmbH Konrad GmbH #LackwerkePeters #MCETechnicalCenter MID Solutions NXP Semiconductors NXP Semiconductors Netherlands B.V. Paderborn University perisens GmbH #ItOM TNO Volkswagen Group This project is funded by 🇩🇪 🇳🇱 Federal Ministry of Education and Research, Germany I Netherlands Enterprise Agency #Researchanddevelopment #innovation #collaboration #ECS #automotive

📰 We've been featured in Markt&Technik about our #chiplet demonstrator collaboration with Fraunhofer IIS, Division Engineering of Adaptive Systems EAS: "How #chiplets are making their way into medium-sized companies": https://lnkd.in/e8kR-bac (page 17). Our collaboration with Fraunhofer IIS/EAS is driving progress in chiplet integration, aiming to overcome challenges and make high-performance chiplet-based systems accessible to medium-sized companies. The original chiplet vision offers manufacturing flexibility for various quantities. While standardization efforts have begun, the collaboration addresses gaps in testing compatibility at the electrical level. There's significant industry interest, especially from #automotive manufacturers and medium-sized companies, seeking chiplet development. Achronix's role in developing a chiplet demonstrator is leveraging our adaptable #FPGAs for optimal system performance that will address challenges such as interposer choices and supply chain adjustments. The collaboration is confident in establishing chiplets, promising higher performance, reduced power consumption, and enhanced resource efficiency. Stay tuned for updates on this innovative journey! 💡 #Semiconductor #ChipletTechnology #FraunhoferIIS

Semiconductors are playing a critical role in supporting Net Zero ambitions. If you're interested in this topic, you won't want to miss the upcoming techUK panel discussion featuring David and other experts. Find out how Pragmatic is advancing sustainable electronics. Sign up now using the link below! #semiconductor #flexIC #innovation