Nortech Systems, Inc.’s Post

PDF Smart sensors and MEMS: Intelligent devices and microsystems for industrial applications Stoyan Nihtianov digsell https://lnkd.in/echgFTWR Smart sensors and MEMS can include a variety of devices and systems that have a high level of functionality. They may integrate sensing and actuating with information processing, analog-to-digital conversion and memory functions. Smart sensors and MEMS may respond to algorithmic instructions and calibration requests, allowing smart devices to become more autonomous as they provide self-diagnostics and self-correction. Intelligence enables adaptation, which in turn increases the reliability and longevity of the smart device and this can significantly reduce costs. Part one covers smart sensors including capacitive, inductive, resistive and image sensors. Part two covers smart MEMS, including power MEMS, RF … Read More » https://lnkd.in/ejTTq2RT

Do you know our true asset in testing? It's a UFO. An ultra-fast optoelectronic probe card. And a real asset for #qualitycontrol in the #semiconductor industry. Our UFO Probe® Card is a practical 2-in-1 test solution that can simultaneously test the electrical and optical functions of modern chips. That comes in handy because photonic integrated circuits (PICs) are conquering the networked world. They are fast, trouble-free and energy-efficient. Their mass production requires correspondingly powerful quality control. Learn more in our blog post about how we're enabling more efficient, economical and cost-effective PIC wafer testing: 💡 https://lnkd.in/eM4YD-st #innovation #morelight #data #digitalization #microelectronics

🚗 Is chiplet-based design ready to be adopted by the #automotive industry? Our newest technical article, published by the EPS - IEEE Electronics Packaging Society and titled "Chiplets for Automotive - Are We There Yet?", explores this topic. Nir Sever, Sr. Director of Business Development at proteanTecs, explains how, for decades, automotive electronics were based on semiconductors manufactured on mature and stable process technologies. Designs were well characterized for robustness; tight screening at the production line enforced quality; and using industry-standard test methodologies assured reliability. Functional safety (#FuSa) relies on monitoring software, system redundancy, and safety protocols. Today, electric vehicles (#EV) and #autonomous driving (#ADAS) require using the most advanced #semiconductor technologies. Reliability requirements exceed those commonly used for commercial applications, device screening becomes a challenge, and safety measures that take effect after an error has already occurred may be insufficient. Chiplet-based designs are driving the most advanced semiconductors for high-performance computing (#HPC) and #AI. But is the automotive industry ready? To read this article on the IEEE EPS website, visit the link in the comments 👇 #Chiplets #AutomotiveSafety #Innovation

In the latest issue of Designing Electronics North America magazine, SiTime's Sumeet Kulkarni details 4 ways in which MEMS #PrecisionTiming solutions are driving the future of automotive innovation. Read the full article 👉 https://lnkd.in/g4qPskJF #SiTime #AutomotiveElectronics #Innovation #HeartbeatOfElectronics

The PCB Revolution of 2023 As we reflect on 2023 at Cygnus Electronics, it's clear that the PCB industry has reached new heights of innovation. 🚀 🔹 Material Mastery: We've seen the rise of LCP and composite materials enhancing wireless communication and durability. 🔹 Design Dynamics: The complexity of multi-layer PCBs has grown, yet our expertise in HDI technology keeps designs compact and powerful. 🔹 Thermal Management: Our advanced solutions in metal core PCBs and conductive materials are keeping the heat down as device power goes up. 🔹 AI Integration: Smarter manufacturing is here, with AI optimizing our processes to unprecedented levels. Sustainability isn't just a buzzword; it's our mission. As we advance, we're committed to eco-friendly practices that pave the way for a greener tomorrow. 🌿 2023 has set the stage for an electrifying 2024, and we're ready to lead the charge with PCB solutions that define the future of electronics. #PCBInnovation #ElectronicsManufactu

Exploring Industrial Cameras: A Guide for Engineers in Life Sciences, Semiconductors, and Automotive Fields 

[PDF] Precision Temperature Sensors in CMOS Technology (Analog Circuits and Signal Processing) Michiel A.P. Pertijs, Johan H. Huijsing, digsell https://lnkd.in/eua4uHhX This book describes the analysis and design of precision temperature sensors in CMOS IC technology, focusing on so-called smart temperature sensors, which provide a digital output signal that can be readily interpreted by a computer. The text shows how temperature characteristics can be used to obtain an accurate digital temperature reading. The book ends with a detailed description of three prototypes, one of which achieves the best performance reported to date. https://lnkd.in/ex5A3_nu

One of the ways to solve for bright lights and other sources of photo-interference when using photoelectric sensors is to tilt the sensor relative to the sensed object and use sensors with background suppression. But what happens when the sensed object has low remittance characteristics like a tyre? SICK Sensor Intelligence ApplicationSelect tool is an unmatched solution for this situation. Using proprietary ASIC microprocessor technology which is now in its 5th generation, SICK photoelectric proximity sensors run a unique digital signal processing algorithm to identify the different sources of light by digitising the photo-current directly at the pixel, reducing noise and increasing sensitivity of the device. In short, ApplicationSelect is a performance booster that can be added to the standard background suppression function, almost doubling the sensing range and a considerable reduction of the black-white shift and the hysteresis. Using ApplicationSelect allows for more robust object detection, easy setup and machine integration and smaller installations which all save our customers time and money. Contact the SICK Sub Sahara Team to find out how your operations can level up with optimised W12 and W4S laser sensor performance based on the learnings from 5 generations of data. This is #sicksensorintelligence

Curious about the future of semiconductor packaging? Our latest blog delves into the advancements of Cu-Cu Hybrid Bonding technology. 💡 Challenges of Bump Scaling: Explore the hurdles in shrinking solder bump pitches and the industry's shift towards Thermocompression Bonding. Emergence of Cu-Cu Hybrid Bonding: Uncover the benefits – ultra-fine pitches, reduced capacitance, and more compact packages. Learn about precision manufacturing and dielectric surface control. Future of Cu-Cu Hybrid Bonding: Witness the ongoing evolution! Efforts are underway to refine processes and overcome challenges for smaller, powerful, and energy-efficient devices. Read more: https://lnkd.in/dSrSXZte Join the conversation on the future of semiconductor technology! #pcxinc #SemiconductorTech #Innovation #TechTrends #CuCuHybridBonding #LinkedInPost