International Semiconductor Executive Summits

A heartfelt thank you to Dr. Rodney Pelzel, CTO at IQE, for his enlightening presentation at I.S.E.S. EU Power 2024! Topic: Epitaxy: The Lithography of GaN Abstract: Dr. Rodney Pelzel discussed the crucial role of GaN on silicon in meeting the world’s need for more efficient power solutions and supporting Net Zero initiatives. He highlighted the rapid development of GaN technology for higher voltage commercial and automotive applications, building on its market insertion in lower voltage uses like efficient USB-C chargers. Dr. Pelzel emphasized the paradigm shift required for GaN on silicon technology, where the key enabler and differentiator lies at the materials/epiwafer level. He explained that advancing GaN on silicon necessitates fundamental materials engineering to address strain and thermal challenges, with epitaxial engineering being the critical innovation. Dr. Pelzel presented data on 650 e/d mode GaN on silicon HEMTs and shared a roadmap for higher voltage nodes, illustrating the evolving landscape of semiconductor innovation. Thank you, Dr. Pelzel, for sharing your expertise and advancing the future of GaN technology! 🌟 #ISESEUPower2024

A big thank you to David Auffret, Automotive Marketing Manager at X-FAB, for his insightful presentation at I.S.E.S. EU Power 2024! Topic: A Foundry Perspective on Wide Bandgap Semiconductors Abstract: David Auffret shed light on the pivotal role of wide bandgap semiconductors such as silicon carbide (SiC) and gallium nitride (GaN) in advancing energy efficiency, especially in the transportation sector. He emphasized the critical role of foundries in scaling up SiC and GaN manufacturing, making these technologies accessible to fabless and fab-lite companies. David provided an overview of X-FAB’s leadership in the automotive, industrial, and medical applications markets, focusing on the power electronics sector from a foundry perspective. He highlighted the benefits of SiC and GaN for power efficiency and carbon neutrality, as well as the challenges of integrating SiC and GaN manufacturing into CMOS processes. David concluded with an outlook on X-FAB’s technology and manufacturing strategy for wide bandgap semiconductors. Thank you, David, for sharing your expertise and driving the future of wide bandgap semiconductor technology! 🌟 #ISESEUPower2024

A huge thank you to Ahmed Ammar, Co-Founder and Head of Product at Lotus Microsystems, for his groundbreaking presentation at I.S.E.S. EU Power 2024! Topic: Introducing Silicon Interposers for Power Applications Abstract: Ahmed Ammar discussed the challenges of increasing power densities in feature-rich electronic devices while managing thermal stress. He introduced the innovative use of silicon interposers in power modules, highlighting their potential to significantly differentiate from the current state of the art. Lotus Microsystems' proprietary process technology for silicon interposers features thicker copper layers, high-density through-silicon vias (TSVs), and high-voltage insulation. This results in superior integration capabilities and high thermal conductivity, enabling best-in-class power density with exceptional thermal performance. Thank you, Ahmed, for sharing your expertise and advancing the future of power applications with silicon interposer technology! 🌟 #ISESEUPower2024

Over the past decade, the semiconductor industry underwent dramatic transformations, driven by relentless technological advancements, market upheavals, and geopolitical turmoil. Intel, once a giant, struggled against fierce competition and process delays, while Samsung boldly expanded its dominance in memory and foundries. TSMC surged ahead, becoming the heartbeat of cutting-edge chip manufacturing. Nvidia's meteoric rise reshaped AI and data centers, and Broadcom's strategic acquisitions showcased its relentless ambition. Qualcomm's 5G innovations opened thrilling new frontiers, and Texas Instruments' steadfast focus on analog and embedded processing secured its place. Micron and SK Hynix fortified their stronghold in memory, while AMD's remarkable resurgence inspired the industry. Amid smaller process nodes, AI, 5G, IoT growth, geopolitical tensions, and high-stakes mergers, leading companies passionately invested in R&D to fuel innovation and stay ahead. As the industry moves forward, the future may lie in quantum computing, advanced AI, and further integration of semiconductors into everyday life, driving unprecedented advancements and opportunities. At International Semiconductor Executive Summits we work with our members to see where this future is emerging

We are incredibly grateful to the distinguished panelists of the GaN Bringing Paradigm Shifts to the Supply Chain Panel Session at I.S.E.S. EU Power 2024 for their enlightening discussion on the transformative impact of GaN technologies! Moderator: - Tamara Baksht, CEO, VisIC Technologies Ltd. Panelists: - Carlos Castro, VP & GM Power GaN FETs, Nexperia - Allan Frederiksen, VP R&D, Cambridge GaN Devices Ltd Devices - Aly Mashaly, Director ATSC, ROHM Co., Ltd. - Americo Lemos, CEO, IQE Key Areas Discussed: - The different flavors of GaN technologies required to cover the power semiconductor market. - How GaN will bring paradigm shifts to the value chain, from processing to epi-growth capability. - Comparative analysis of price and volume scaling of GaN vs. SiC. Thank you to all the panelists for sharing your expertise and strategic insights, highlighting the paradigm shifts GaN technologies will bring to the supply chain! #ISESEUPower2024

A huge thank you to the esteemed panelists of the GaN Valley TM Panel Session at I.S.E.S. EU Power 2024 for their in-depth discussion on the progress and challenges of GaN technologies and the GaN industry! Moderator: - Marnix Tack, PhD, CTO & VP Business Development, BelGaN Panelists: - Alexander Krick, EVP Technical Development, Volkswagen - Vincent MERIC, VP Marketing, AIXTRON SE - Christophe Maleville, CTO, SOITEC - Elke Meissner, Strategic Business Development Semiconductor Materials and Technology, Fraunhofer IISB - Andrew Patterson, Sales Director - EMEA, Silvaco Inc Key Areas Discussed: - Main challenges to accelerate the business growth of the GaN industry in Europe and how to compete with China. - Strategies to attract and develop the necessary GaN talent in Europe to support business growth. - Promising future WBG technologies anticipated to emerge over the next five years. Thank you to all the panelists for sharing your expertise and strategic insights, ensuring Europe remains competitive in the global GaN industry! 🌟 #ISESEUPower2024

A heartfelt thank you to the distinguished panelists of the session "How is the Ecosystem Managing EV & WBG Market Beyond China?" at I.S.E.S. EU Power 2024 for their enlightening discussion on the future of the EV and WBG market! Moderator: - Marc Mangrum, Senior Director of the Wirebond/Power Business Unit for Europe, Amkor Technology, Inc. Panelists: - Christian Kluthe, Head of Product Area High Voltage Power Semiconductors and Modules, Bosch - Vishnu Kumaresan, PhD, Semiconductor Business Specialist & Segment Leader, Volvo Group - Stefan Obersriebnig, SVP High Voltage Modules, Infineon Technologies - Christophe Maleville, CTO, SOITEC Abstract: This high-level panel discussed how Europe can leverage its technological expertise in power electronics through innovations in materials, packaging, and fab technology to maintain a leading position in an increasingly competitive global market. The panelists shared strategies for managing the changing automotive landscape amidst the rising dominance of China, highlighting the importance of collaboration and innovation. Thank you to all the panelists for sharing your insights and strategies, ensuring Europe remains at the forefront of the EV and WBG market! 🌟 #ISESEUPower2024

A heartfelt thank you to Stefan Obersriebnig, SVP High Voltage Modules at Infineon Technologies, for his insightful session at I.S.E.S. EU Power 2024! Session Title: EV Market Trends and the Status-Quo of Automotive Power Semiconductors Abstract: Stefan Obersriebnig delved into the key trends shaping the automotive power market, highlighting the current challenges faced by the industry. He discussed the pivotal role of semiconductor makers in overcoming these challenges, emphasizing the importance of innovation and collaboration. Stefan's presentation provided valuable insights into the evolving landscape of electric vehicles and the critical contributions of power semiconductors in driving this transformation. Thank you, Stefan, for your expertise and for guiding us through the future of automotive power semiconductors! #ISESEUPower2024

A big thank you to Ralf Keggenhoff, Global Director of Application Engineering, Semiconductor Business Unit at Littelfuse, for his insightful session at I.S.E.S. EU Power 2024! Session Title: Isolation - A Package Requirement Abstract: Ralf Keggenhoff explored the complexities of achieving higher power throughput in smaller housings while balancing efficiency and cost in power electronics. He highlighted the challenge of increased thermal stress due to higher currents, which can reduce the lifespan of devices. To address this, Ralf discussed the potential of using wide bandgap SiC-MOSFETs instead of silicon-based IGBTs, despite the higher cost. Additionally, he introduced an innovative approach focusing on direct liquid cooling for power semiconductors, circumventing the limitations of insulating substrates for thermal transfer. His presentation underscored the need for innovative solutions to optimize power electronics performance and longevity. Thank you, Ralf, for sharing your expertise and innovative approaches to enhancing power electronics! #ISESEUPower2024

A special thank you to Pavel Freundlich, Ph.D., Chief Technology Officer & Vice President, Power Solutions Group at onsemi, for his transformative session at I.S.E.S. EU Power 2024! Session Title: Transforming The Power World: The Wide-Bandgap Conversion Abstract: Pavel Freundlich discussed the evolution of power conversion technology, emphasizing the limitations of traditional silicon devices, which have been the backbone of power conversion for the past 70 years. As silicon reaches its physical limits, the power semiconductor industry is turning to wide bandgap materials and devices, which offer superior current densities, operating temperatures, frequencies, and switching efficiencies. Despite their advantages, wide bandgap power transistors present new challenges that require innovative approaches in crystal growth, wafering, epitaxy, wafer processing, and packaging. Pavel highlighted how vertically integrated manufacturing can address these challenges and accelerate the growth of the wide bandgap power semiconductor industry. He also touched on the co-existence of wide bandgap and silicon power switches. Thank you, Pavel, for your visionary insights and for leading the charge in the wide bandgap revolution! #ISESEUPower2024